Browse Source

Add back cover feature description

master
Dejvino 3 years ago
parent
commit
4d14bc667e
3 changed files with 8 additions and 0 deletions
  1. +8
    -0
      README.md
  2. BIN
      feature_bottom_pip.png
  3. BIN
      feature_bottom_pip_xray.png

+ 8
- 0
README.md View File

@@ -8,6 +8,14 @@ Pip-Boy inspired phone holder built around the PINE64 PinePhone.
- OpenScad
- [BOSL library](https://github.com/revarbat/BOSL)

## Features
### PIP slideout back cover
The back cover is composed of two interconnected components, printed in place (PIP). This allows the cover to expand and retract again, automatically connecting any connectors fixed to the cover.
![Back model](feature_back_pip.png)

The inner construction makes sure the back cover remains sturdy and the two pieces are inseparable. See the "xray":
![Back model xray](feature_back_pip_xray.png)

## Build Instructions
See [Instructions Readme](instructions/README.md).


BIN
feature_bottom_pip.png View File

Before After
Width: 800  |  Height: 361  |  Size: 99 KiB

BIN
feature_bottom_pip_xray.png View File

Before After
Width: 800  |  Height: 345  |  Size: 57 KiB

Loading…
Cancel
Save