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Add back cover feature description

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      README.md
  2. Binārs
      feature_bottom_pip.png
  3. Binārs
      feature_bottom_pip_xray.png

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README.md Parādīt failu

@@ -8,6 +8,14 @@ Pip-Boy inspired phone holder built around the PINE64 PinePhone.
- OpenScad
- [BOSL library](https://github.com/revarbat/BOSL)

## Features
### PIP slideout back cover
The back cover is composed of two interconnected components, printed in place (PIP). This allows the cover to expand and retract again, automatically connecting any connectors fixed to the cover.
![Back model](feature_back_pip.png)

The inner construction makes sure the back cover remains sturdy and the two pieces are inseparable. See the "xray":
![Back model xray](feature_back_pip_xray.png)

## Build Instructions
See [Instructions Readme](instructions/README.md).


Binārs
feature_bottom_pip.png Parādīt failu

Pirms Pēc
Platums: 800  |  Augstums: 361  |  Izmērs: 99 KiB

Binārs
feature_bottom_pip_xray.png Parādīt failu

Pirms Pēc
Platums: 800  |  Augstums: 345  |  Izmērs: 57 KiB

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