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Add back cover feature description

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Dejvino 3 年前
父节点
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共有 3 个文件被更改,包括 8 次插入0 次删除
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      README.md
  2. 二进制
      feature_bottom_pip.png
  3. 二进制
      feature_bottom_pip_xray.png

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README.md 查看文件

@@ -8,6 +8,14 @@ Pip-Boy inspired phone holder built around the PINE64 PinePhone.
- OpenScad
- [BOSL library](https://github.com/revarbat/BOSL)

## Features
### PIP slideout back cover
The back cover is composed of two interconnected components, printed in place (PIP). This allows the cover to expand and retract again, automatically connecting any connectors fixed to the cover.
![Back model](feature_back_pip.png)

The inner construction makes sure the back cover remains sturdy and the two pieces are inseparable. See the "xray":
![Back model xray](feature_back_pip_xray.png)

## Build Instructions
See [Instructions Readme](instructions/README.md).


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feature_bottom_pip.png 查看文件

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宽度: 800  |  高度: 361  |  大小: 99 KiB

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feature_bottom_pip_xray.png 查看文件

之前 之后
宽度: 800  |  高度: 345  |  大小: 57 KiB

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